: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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MBF / TSSOP Series Of Plastic Seal MGP Mold High Durability LKM Standard

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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City: Dongguan

Province/State: Guangdong

Country/Region: China

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MBF / TSSOP Series Of Plastic Seal MGP Mold High Durability LKM Standard

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MBF / TSSOP Series Of Plastic Seal MGP Mold High Durability LKM Standard

MBF/TSSOP Series Of Plastic Seal Molds (MGP Molds) Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. Cavity Bar uses high-speed ...

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LKM Standard MGP Mold

LKM Standard MGP Mould

MGP Mould High Durability

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